Howa Sangyo, Shinshu Nagase Co., Ltd. and Idea System Co., Ltd. have developed "TEG Kit for Flip-chip¥BGA Mounting Evaluation" together and started selling it on July, 1st, 2000.
* This product enables us to do experiments of flip mounting and BGA mounting without initial cost or trouble.
* This product enables us to check the condition of mounting and to measure contact resistance with a check terminal (Quadrupole Measurement)
1. Chip for F/C Mounting --10x10x0.625(mm) with Au Stud Bumps
2. Substrate for F/C Mounting -- 21x21x0.8(mm)
4 Layers double-sided substrate (with respective check terminal)
3.Substrate for BGA Mounting -- 60x60x1.6(mm)
*There are various kinds of options for a bump and cell.
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